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Your Microelectronic Package Assembly Solution for MEMS Sensors

SMART Microsystems, located in the Desich Smart Center for Microsystems on LCCC's campus, creates turn-key solutions for microelectronic package assembly challenges to move MEMS sensor technology from development to production. With an engineering team experienced in manufacturing and state-of-the-art facilities, SMART Microsystems accelerates the transition of new MEMS sensor products to the market.

Microelectronic package assembly is a key part of the manufacturing process for MEMS sensor products. Our core capabilities and expertise support the development, testing and manufacturing of designs provided by our customers. For niche applications, package assembly solutions offer more flexibility, faster lead times and lower cost than system on chip approaches.

The Desich Smart Center for Microsystems provides over 15,000 square feet of space including 5,000 square feet of ISO 6 (class 1000) and ISO 5 (class 100) cleanrooms.

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